NEG® Glass Powder for Electronic Applications
Powdered glass is widely used for hermetic sealing and coating of electronic components, insulation, and circuit board formation. The low firing temperature, which does not damage the The low firing temperature, which does not damage the semiconductors, and the matching of the thermal expansion ratio with the materials to be joined, etc. are all part of the process. In order to meet the different requirements of each component, NEG has developed and supplied hundreds of products to meet the needs of customers. I am.
Glass powder is widely used in the packaging, wrapping, insulating and circuit board formation of electronic components. In order to meet the requirements of different electronic components, e.g. low sintering temperature without damage to the semiconductor, low sintering temperature with the bonding material, low sintering temperature with the bonding material, and low sintering temperature with the bonding material, the glass powder is used in the production of electronic components. NIPPON ELECTRIC NITES has developed and supplied hundreds of products to match the expansion rate of the material.
1. Glass for Al2O3 packaging is used for fine ceramic packages of Al2O3. Packaging for installation.
Low-expansion precision ceramic packaging glass is suitable for aluminum nitride and mullite (compounds of aluminum oxide and silicon dioxide). The packaging of the product is made of silicon carbide, silicon carbide, etc.
3. Low-melting point glass with composite and crystalline coating for display.
4.Hermetically sealed terminals and glass pellets for supporting parts have good filling and tablet forming properties.
5. Low pressure and high pressure glass is available.
6.Passivation glass is available in lead-substituted glass and lead-based glass.
7.Precision glass-ceramic inner layer conductors for low-temperature sintering of multilayer substrates can be made of gold or silver with high electrical conductivity to achieve good electrical characteristics. The circuit board. In addition, gold, silver alloy and copper can be used for the surface guide.
8. Glasses for coating and bonding can be used as Glaze (glass overlay) on substrates or Binder (thick film) on antibodies. (gluing agent).